Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications Auteur(s): Granado Lérys, Kempa Stefan, Gregoriades Laurence John, Brüning Frank, Bernhard Tobias, Flaud Valérie, Anglaret E., Fréty Nicole (Article) Publié: Acs Applied Electronic Materials, vol. 1 p.1498-1505 (2019) Ref HAL: hal-02641688_v1 DOI: 10.1021/acsaelm.9b00290 WoS: 000496315000019 Exporter : BibTex | endNote 1 Citation |