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- Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications doi link

Auteur(s): Granado Lérys, Kempa Stefan, Gregoriades Laurence John, Brüning Frank, Bernhard Tobias, Flaud Valérie, Anglaret E., Fréty Nicole

(Article) Publié: Acs Applied Electronic Materials, vol. 1 p.1498-1505 (2019)