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- Nanometre scale reactive ion etching of GaN epilayers hal link

Auteur(s): Coquillat D., Murad Sk, Ribayrol A., Smith Cjm, De La Rue Rm, Wilkinson Cdw, Briot O., Aulombard R.

Conference: 7th International Conference on Silicon Carbide, III-Nitrides and Related Materials (ICSCIII-N 97) (STOCKHOLM (SWEDEN), SE, 1997-08-31)
Actes de conférence: SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, vol. 264-2 p.1403-1406 (1998)


Ref HAL: hal-00546188_v1
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Résumé:

We have demonstrated a process for the fabrication of sub-micron structures using high resolution etching to transfer patterns by masking with a bilayer of Titanium and SiNX. Reactive ion etching (RIE) was performed on GaN epilayers grown on (0001) sapphire by metal organic vapour phase epitaxy (MOVPE). Various chemistries were used to etch GaN including: HBr, SiCl4/HBr, CH4/H-2, NH3/CH4/H-2 and CH4/H-2/O-2 I?Patterns including pillars, holes and gratings with feature: sizes ranging from 200 nm to 1 mu m were produced. In a CH4/H-2 plasma, quasi-vertical etching was achieved with sidewall angles greater than 81 degrees.