Ref HAL: hal-04236808_v1
Ref Arxiv: 2310.06472
DOI: 10.48550/arXiv.2310.06472
Ref. & Cit.: NASA ADS
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Résumé:

Despite several decades of development, microfluidics lacks a sealing material that can be readily fabricated, leak-tight under high liquid water pressure, stable over a long time, and vacuum compatible. In this paper, we report the performances of a micro-scale processable sealing material for nanofluidic/microfluidics chip fabrication, which enables us to achieve all these requirements. We observed that micrometric walls made of SU-8 photoresist, whose thickness can be as low as 35 $μ$m, exhibit water pressure leak-tightness from 1.5 bar up to 5.5 bar, no water porosity even after 2 months of aging, and are able to sustain under $10^{-5}$ mbar vacuum. This sealing material is therefore reliable and versatile for building microchips, part of which must be isolated from liquid water under pressure or vacuum. Moreover, the fabrication process we propose does not require the use of aggressive chemicals or high-temperature or high-energy plasma treatment. It thus opens a new perspective to seal microchips where delicate surfaces such as nanomaterials are present.